electronic circuit board (249) Online Manufacturer
Key Words: High Density Interconnector
Layer Count: 4-20 Layers
Min Line Width/Spacing: 0.1mm
Solder Mask Colour: Black
Min Hole Dia: 0.075 Mm
Feature: 100% E-test
Thickness: 0.4-3.2mm
Layer Count: 4-20 Layers
Solder Mask Color: Clients Required
Materials: Ventec, Polytronics, Begquist
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Min. Line Width/Spacing: 0.075/0.075mm
Layer Count: 4-20 Layers
Minimum Hole Size: 0.15mm
Impedance Control: Yes
Hole Size: 0.1mm Laser Drill
Min Trace: 3/3Mil
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Layer Count: 4-20 Layers
Testing: 100%E-Testing,X-RAY
Pcb Name: 4L 1+N+1 HDI Boards
Special Requirements: Lamp Socket
Thickness: 0.2mm
Layers: 2
Feature: 100% E-test
Layers: Double
Profiling Punching: Routing, V-CUT, Beveling
Material: FR4, Polyimide, PET
Max Layer: 52L
Hole Position Deviation: ±0.05mm
Max Layer: 52L
Material: FR4, Polyimide, PET
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