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Impedance Controlled Multilayer PCB Board 0.5oz-6oz Copper For Stable Signal Transmission

Layers: 4-22 Layer

Packing: Vacuum Packing With Carton Box

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6-32L Board Layer HDI PCB Board Made of FR4 IT180 Raw Material and 0.1mm Laser Drill Hole Size for Applications

Key Words: High Density Interconnector

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

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High Aspect Ratio 10 1 HDI PCB Board with P1.5 Spacing and 0.3mm Min. Bga Pitch

Blind Vias: Yes

Key Words: High Density Interconnector

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Custom PCB Multilayer PCB Board with 0.4mm Thickness and 4L-28L Layers Performance

Packing: Vacuum Packing With Carton Box

Size: As Per Gerber

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IPC-A-610E Standard HASL/OSP/ENIG PCB Board with Immersion Gold and 0.5-14oz 18-490um Copper Thickness

Minimum Hole Diameter: 0.10 Mm

Final Foil External: 1.oz

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Advanced SMT THT DIP SMT PCB Assembly with HDI PCB Board and Min. Solder Mask Bridge 0.075mm

Copper Thickness: 0.5oz-6oz

Pcb Assembly Process: SMT THT DIP SMT PCB Assembly

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Professional Immersion Silver Multilayer PCB Board Service 4-32 Layers

Special Requirements: Multiclass Impedance

Service: One-stop Service OEM

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Surface Mount Technology Compatible HDI PCB Board with White Silkscreen and 1.6mm Thickness

Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.

Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.

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Six Layers RO4835+4350 Rogers PCB Board High Frequency PCB Customized

Glass Epoxy: RO4730G3 0.762mm

Dielectric Constant: 2.55-10.2

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