electronic circuit board (365) Online Manufacturer
Layer Count: 2
Min Hole Size: 0.2MM
Layers: 4-22 Layer
Packing: Vacuum Packing With Carton Box
Key Words: High Density Interconnector
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Min Trace: 3/3Mil
Board Layer: 6-32L
Blind Vias: Yes
Key Words: High Density Interconnector
Impedance Control: +/-10%
Bga: 10MIL
Inner Layer Spacing: 0.15mm
Thickness: 0.4-3.2mm
Packing: Vacuum Packing With Carton Box
Size: As Per Gerber
Minimum Hole Diameter: 0.10 Mm
Final Foil External: 1.oz
Surface Mount Technology: Available
Vip Process: Yes
Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Special Requirements: Multiclass Impedance
Service: One-stop Service OEM
Size: /
Copper Thickness: 0.5oz-6oz
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
Surface: OSP
Copper: 1oz
Glass Epoxy: RO4730G3 0.762mm
Dielectric Constant: 2.55-10.2
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