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LED Screen P1.25 4L 1+N+1 HDI Specialty PCB Board With 0.15mm Minimum Hole Size For Lamp Socket Applications

Minimum Hole Size: 0.15mm

Raw Material: FR4 IT180

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Special Lamp Socket High Density Interconnector PCB Board 10 Layers Tuc TU-872 1+N+1 Goldfinger 30U"+ENIG HDI Prototype PCB

Impedance Control: Yes

Board Layer: 6-32L

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FR4 IT180 4-20 Layers HDI PCB Board with Multi Impedance Control and 0.1mm Hole Nickel-Palladium BGA 0.2mm

Impedance Control: Yes

Aspect Ratio: 10:1

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Impedance Control HDI PCB Board With Aspect Ratio 10 1 And Special Request Half Hole HDI Quick Turn Up To 24H

Key Words: High Density Interconnector

Layer Count: 4-20 Layers

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12-Layer IMS PCB Board for High Voltage Applications High Withstand Voltage 3KV

Surface Finishing: Plated Ni/Au

Min. Silkscreen Bridge: 0.1mm

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Al2O3/ALN Electronics Ceramic PCB Board 0.1mm Min Line Black Solder Mask

Min Line Width/Spacing: 0.1mm

Solder Mask Colour: Black

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1-6oz Copper Weight Double Sided PCB Printed Circuit Board High Performance

Min Hole Dia: 0.075 Mm

Feature: 100% E-test

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1.oz Final Foil External Custom Pcb Multilayer PCB Board for Special Requirement Impedance Control Test

Thickness Of Copper: 0.5-14oz (18-490um)

Surface Finishing: HASL/OSP/ENIG

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8L 2+2+N+2+2 High Density Interconnect PCB For Industrial Applications With Impedance Control And 100% E Testing

Thickness: 0.4-3.2mm

Layer Count: 4-20 Layers

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Multiclass Impedance Multilayer PCB Board with 4-22 Layers and 4-32 Layers Design

Copper Thickness: 0.5oz-6oz

Max. Panel Size: 600mm*1200mm

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4-32 Layers Multilayer PCB Board with 0.2mm Min. Hole Size and 0.2mm-6.0mm Thickness

Surface Mount Technology: Yes

Packing: Vacuum Packing With Carton Box

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SMT THT DIP Assembly Process HDI PCB Board with HASL Surface Finish and 0.5oz-6oz Copper Thickness

Thickness: 1.6mm, ±10%

Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.

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1oz Finished Copper Thickness High Density Model Board with Immersion Silver Coated Surface Enhancement

Surface Mount Technology: Available

Thickness: 1.6mm, ±10%

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100%E-Testing Glass Epoxy PCB Board with Blind And Buried Vias and Immersion Surface

Blind And Buried Vias: Available

Thickness: 0.4-3.2mm

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High Density Interconnector High Density Model Board with Special Requirements and Lamp Socket

Aspect Ratio: 10:1

Raw Material: FR4 IT180

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Clients Required IMS PCB 1 Layer HASL Surface Finish Board With ISO 13485 Certification

Solder Mask Color: Clients Required

Materials: Ventec, Polytronics, Begquist

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electronic circuit board Online Manufacturer

HDI PCB Board

Multilayer PCB Board

Rogers PCB Board

Rigid Flex PCB

Ceramic PCB Board

HDI Any Layer PCBs

IC Substrate PCBs

Substrate Like PCBs

Heavy Copper PCB

IMS PCB

Double Sided PCB

White Silk HDI Printed Circuit Boards 0.4-3.2mm Thickness for Performance and Durability

Impedance Control Test Multilayer Circuit Board with 0.4mm Board Thickness

SMT Multilayer Printed Circuit Board Multiclass Impedance 12OZ Copper 0.2-6.0mm

Ultra Dense HDI Circuit Board With 0.15mm Minimum Hole Line Width Line Distance 2Mil Goldfinger 150U"

LED Screen P1.25 4L 1+N+1 HDI Specialty PCB Board With 0.15mm Minimum Hole Size For Lamp Socket Applications

Special Lamp Socket High Density Interconnector PCB Board 10 Layers Tuc TU-872 1+N+1 Goldfinger 30U"+ENIG HDI Prototype PCB

FR4 IT180 4-20 Layers HDI PCB Board with Multi Impedance Control and 0.1mm Hole Nickel-Palladium BGA 0.2mm

Impedance Control HDI PCB Board With Aspect Ratio 10 1 And Special Request Half Hole HDI Quick Turn Up To 24H

12-Layer IMS PCB Board for High Voltage Applications High Withstand Voltage 3KV

Al2O3/ALN Electronics Ceramic PCB Board 0.1mm Min Line Black Solder Mask

1-6oz Copper Weight Double Sided PCB Printed Circuit Board High Performance

1.oz Final Foil External Custom Pcb Multilayer PCB Board for Special Requirement Impedance Control Test

8L 2+2+N+2+2 High Density Interconnect PCB For Industrial Applications With Impedance Control And 100% E Testing

Multiclass Impedance Multilayer PCB Board with 4-22 Layers and 4-32 Layers Design

4-32 Layers Multilayer PCB Board with 0.2mm Min. Hole Size and 0.2mm-6.0mm Thickness

SMT THT DIP Assembly Process HDI PCB Board with HASL Surface Finish and 0.5oz-6oz Copper Thickness

1oz Finished Copper Thickness High Density Model Board with Immersion Silver Coated Surface Enhancement

100%E-Testing Glass Epoxy PCB Board with Blind And Buried Vias and Immersion Surface

High Density Interconnector High Density Model Board with Special Requirements and Lamp Socket

Clients Required IMS PCB 1 Layer HASL Surface Finish Board With ISO 13485 Certification