Impedance Control: +/-10%
Misalignment Of Layers: +/- 0.06
Impedance Control: +/-10%
Bga: 10MIL
Test: 100% Electrical Test Prior Shipment
Bga: 10MIL
Blind Vias: Yes
Key Words: High Density Interconnector
Min. Bga Pitch: 0.3mm
Impedance Control: +/-10%
Key Words: High Density Interconnector
Feature: Immersion Silver
Surface Mount Technology: Available
Thickness: 1.6mm, ±10%
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
Surface Mount Technology: Available
Vip Process: Yes
Thickness: 1.6mm, ±10%
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
Min Trace: 3/3Mil
Pcb Thickness: 1.6mm
Blind And Buried Vias: Available
Thickness: 0.4-3.2mm
Thickness: 0.4-3.2mm
Blind And Buried Vias: Available
Inner Layer Spacing: 0.15mm
Thickness: 0.4-3.2mm
Smallest Hole Size: 0.1mm
Min Via: 0.1mm
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