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rogers circuit board (47)  Online Manufacturer

8 Layers Rogers RO4003+FR4 TG170 Gold Surface Rogers Board PCB Green Solder Mask

Function: 100% Pass Electrical Test

Solder Mask: Green, Black, Blue, Yellow, Red Etc.

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Rogers Material PCB 0.762mm Glass Epoxy Yellow Coverlay White Silkscreen

Surface: Gold

Glass Epoxy: RO4730G3 0.762mm

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High Speed TU-933 FR-4 Glass Epoxy DK 3.6 Multilayer PCB Board 4-22 Layers

Thickness: 0.2mm-6.0mm

Copper Weight: 12OZ

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SMT THT DIP Assembly Process HDI PCB Board with HASL Surface Finish and 0.5oz-6oz Copper Thickness

Thickness: 1.6mm, ±10%

Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.

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1.6mm Thickness HDI PCB Board with High Density Interconnector and 1oz Finished Copper Thickness

Finished Copper Thickness: 1oz

Silkscreen: White, Black, Yellow, Etc.

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Advanced SMT THT DIP SMT PCB Assembly with HDI PCB Board and Min. Solder Mask Bridge 0.075mm

Copper Thickness: 0.5oz-6oz

Pcb Assembly Process: SMT THT DIP SMT PCB Assembly

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100%E-Testing Glass Epoxy PCB Board with Blind And Buried Vias and Immersion Surface

Blind And Buried Vias: Available

Thickness: 0.4-3.2mm

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1oz Finished Copper Thickness High Density Model Board with Immersion Silver Coated Surface Enhancement

Surface Mount Technology: Available

Thickness: 1.6mm, ±10%

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Panasonic M6 M8 FR-4 4-22 Layers Multilayer PCB Board High Speed PCB Prototype

Min. Hole Size: 0.2mm

Max. Panel Size: 600mm*1200mm

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Turnaround Any Layer HDI PCB With Minimum 3mil Line HASL / ENIG Surface Finish ROGERS+FR4

Min. Finished Hole Size: 0.1mm

Minimum Line Width/Spacing: 3mil/3mil

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16 1 Vias Aspect Ratio HD SDI Converter for High Definition Video Conversion in Broadcast Industry

Silkscreen: White, Black, Yellow, Etc.

Pcb Assembly Process: SMT THT DIP SMT PCB Assembly

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Customizable Glass Epoxy HDI PCB with 10 1 Aspect Ratio and OSP Surface Finish

Copper Thickness: 0.5oz-6oz

Key Words: High Density Interconnector

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High Copper Weight Multilayer Pcbs 4-22 Layers Tg170 FR-4 Glass Epoxy 12OZ

Min. Hole Size: 0.2mm

Thickness: 0.2mm-6.0mm

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