multi layer printed circuit board (61) Online Manufacturer
Material: FR4, Polyimide, PET
Sanforized: Local High Density, Back Drill
Raw Material: FR4 IT180
Layer Count: 4-20 Layers
Surface Mount Technology: Yes
Packing: Vacuum Packing With Carton Box
Lead Time: 2-5 Days
Min. Annular Ring: 3mil
Material: FR4, Polyimide, PET
Flexibility: 1-8 Times
No Of Layers: 4 Layer
Max Layer: 52L
Sanforized: Local High Density, Back Drill
Profiling Punching: Routing, V-CUT, Beveling
Material: FR4, Polyimide, PET
Pcb Layer: 1-28layers
Special Requirements: Multiclass Impedance
Number Of Layers: 4-32 Layers
Treatment: ENIG/OSP/Immersion Gold/Tin/Silver
Surface Finishing: HASL LF
Max Layer: 52L
No Of Layers: 4 Layer
Pcb Layer: 1-28layers
No Of Layers: 4 Layer
Raw Material: FR4 IT180
Impedance Control: Yes
Board Layer: 6-32L
Thickness: 0.4-3.2mm
Number Of Layers: 4-22 Layers
Packing: Vacuum Packing With Carton Box
Size: /
Max. Panel Size: 600mm*1200mm
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