6 Layers Lamp Socket FR4 It180 Density Interconnector HDI PCB Board Half Hole 3/3Mil Impedance Control
The 4L 1+N+1 HDI Boards represent a pinnacle of modern High Speed PCB design and HDI PCB Manufacturing techniques. These boards are specifically engineered to cater to the burgeoning demands of high-density interconnect technology, which is essential in today's miniaturized and high-performance electronic devices. As a cutting-edge solution, these circuit boards are an embodiment of precision, reliability, and efficiency.
At the core of the HDI PCB Board product is the board layer capability, which ranges from 6 to 32 layers. This extensive range allows for a versatile application across various industries, including telecommunications, medical devices, and consumer electronics, to name a few. The multi-layer configuration is adept at managing the complex routing requirements of high-speed signals, ensuring signal integrity and minimal interference.
One of the distinctive features of these HDI Boards is the implementation of the 1+N+1 build-up technology. This structure indicates one layer of high-density interconnection above and below the core layer (N). The design provides a compact, yet highly functional layout that enables the integration of a greater number of components on a single board. This is particularly advantageous for devices that require sophisticated circuitry within a limited space.
The precision of the HDI PCB Board is further exemplified by its minimum hole size of 0.15mm. This fine hole size allows for the creation of smaller vias, which in turn leads to the optimization of PCB real estate. By using these smaller vias, more space is made available for additional components or for enhancing the thermal properties of the PCB.
Moreover, the PCB features a hole size of 0.1mm achieved through laser drilling technology. Laser drilling offers unparalleled accuracy when compared to mechanical drilling, permitting the creation of microvias with minimal deviation. This level of precision is essential for maintaining the performance of high-speed PCBs, as even minute discrepancies can significantly affect signal integrity.
The HDI PCB Board product is synonymous with High Density Interconnector technology. The high-density aspect refers to the tightly packed electronic components and the interconnections between them. By employing advanced HDI technology, these PCBs are able to support a higher number of I/Os in a smaller footprint. This is particularly crucial for high-speed applications where performance and space constraints are paramount.
In the realm of High Speed PCB, signal integrity is of the utmost importance. The HDI PCB Boards are designed to meet these high-speed demands with features that minimize signal loss and cross-talk. The careful layering and high-quality materials used in the PCB contribute to its exceptional performance at high frequencies.
The HDI PCB Manufacturing process for these boards is a testament to the advancements in PCB fabrication technology. It involves sophisticated techniques such as sequential lamination, microvia formation, and conductive or non-conductive via fill processes. Each step is meticulously controlled to ensure that the final product meets the rigorous standards required by high-speed applications.
In summary, the 4L 1+N+1 HDI Boards are a state-of-the-art solution for high-speed and high-density applications. With features such as 6-32L board layers, 0.15mm minimum hole size, and 0.1mm laser-drilled holes, these PCBs are engineered to meet the exacting demands of today's sophisticated electronic devices. Through a combination of innovative design and precision manufacturing, the HDI PCB Board product stands at the forefront of the industry, driving the future of electronic interconnectivity.
| Technical Parameter | Specification |
|---|---|
| Raw Material | FR4 IT180 |
| Testing | 100%E-Testing, X-RAY |
| Board Thickness | 0.2mm-6.00mm (8mil-126mil) |
| Board Layer | 6-32L |
| Special Requirements | Lamp Socket |
| Aspect Ratio | 10:1 |
| Hole Size | 0.1mm Laser Drill |
| Special Request | Half Hole, 0.25mm BGA |
| Min Trace | 3/3Mil |
| Thickness | 0.4-3.2mm |
HDI Printed Circuit Boards (HDI PCBs) are essential components in modern electronics, offering higher circuitry density than traditional PCBs. The application occasions and scenarios for HDI PCBs with a layer count of 4-20 layers are numerous and varied, encompassing a wide range of industries and technologies. With a minimum hole size of 0.15mm, these boards are specifically designed to accommodate the increasingly miniaturized and sophisticated components found in advanced electronic devices.
One of the primary application scenarios for HDI PCBs is in the telecommunications industry, where high-speed PCB performance is critical. The necessity for rapid signal transmission in smartphones, routers, and switches demands the superior electrical properties and reliability provided by HDI technology. The fine-pitch Ball Grid Array (BGA) of 0.25mm on these PCBs is particularly suited for compact and high-performance telecom hardware.
The computing sector also benefits greatly from HDI PCB Manufacturing, especially in the realm of laptops and desktops. High-layer-count HDI PCBs enable the integration of multiple functions within a limited space, improving the overall performance of the computer while reducing its footprint. Impedance control is a crucial attribute in these applications, ensuring signal integrity across the complex circuitry of multi-layered boards.
Automotive electronics is another field where HDI PCBs are increasingly utilized. The rugged nature of the FR4 IT180 raw material used in these boards provides the durability needed to withstand the harsh environments encountered in automotive applications. Features such as half holes are often used for edge connectors, improving the reliability of connections in car control systems, infotainment, and safety features.
In the medical industry, the compactness and enhanced capabilities of HDI PCBs allow for sophisticated medical devices and instruments. Diagnostic equipment, such as MRI machines and portable ultrasound devices, benefit from the high-density integration that HDI PCBs offer, allowing for more complex capabilities while maintaining a user-friendly form factor.
Lastly, the aerospace industry, where performance and reliability are paramount, makes extensive use of HDI PCBs. The high layer count and precise impedance control are critical for the function of satellite communication systems, cockpit electronics, and navigation controls. The robustness of the FR4 IT180 material ensures that these boards can endure the extreme conditions of aerospace environments.
In summary, the versatility of HDI PCBs with attributes like 4-20 layers, minimum hole size of 0.15mm, half hole capabilities, 0.25mm BGA, and impedance control, combined with the use of high-quality FR4 IT180 raw material, makes them suitable for a wide range of high-speed, high-reliability applications across various cutting-edge industries.
Our High Density PCB services offer exceptional customization for your HDI PCB Board requirements. With precision crafting, we can accommodate a Minimum Hole Size as small as 0.15mm, ensuring that even the most intricate designs are possible. Catering to a diverse range of applications, our boards can be configured from 6 to 32 layers (Board Layer), providing the versatility needed for complex High Speed PCB Board assemblies.
Understanding the need for specialized design features, we also accept Special Requests such as Half Hole and 0.25mm BGA, to meet the most challenging design parameters. Our capability extends to producing Layer Counts ranging from 4 to 20 Layers, giving you the freedom to design High Density Interconnector boards that meet your exact specifications. Choose our services for a tailored HDI PCB solution that meets your high-speed, high-density requirements.
Our HDI PCB Board is designed with the latest in high-density interconnect technology, providing superior performance and reliability for demanding applications. To ensure the best experience with our product, we offer comprehensive technical support and services.
If you encounter any issues or have questions regarding your HDI PCB Board, our expert technical support team is available to assist you. Our services include troubleshooting assistance, product usage guidance, and tips for optimizing performance.
We also offer advanced services for more complex requirements, such as design consultation for integration with existing systems, signal integrity analysis, and thermal management solutions. Our goal is to help you maximize the benefits of our HDI PCB products in your specific applications.
To enhance your experience, we provide a wealth of resources, including detailed product documentation, application notes, and FAQs. These resources are designed to help you quickly find answers to common questions and to understand the best practices for using our HDI PCB Boards.
For continuous improvement of our products and services, we welcome and value your feedback. Please feel free to share your experiences and suggestions with our support team.
Our commitment to excellence is reflected in our rigorous quality assurance process, ensuring that each HDI PCB Board meets the highest standards before it reaches you. Rest assured that we are dedicated to providing you with the support and services you need to succeed.
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