dual sided pcb (65) Online Manufacturer
Substrate Type: Rigid
Minimum Hole Size: 0.2mm
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
Conductor Space: 5 Mil
Surface Finishing: HASL,OSP,ENIG,Immersion Gold,lead Free
Number Of Layers: 2
Copper: 1oz
Surface Finishing: HASL,OSP,ENIG,Immersion Gold,lead Free
Min. Hole To Copper: 0.2mm
Other Service: PCB Design/PCB Assembly
Materials: FR4
Solder Resist Color: Green
Number Of Layers: 2
Special Technology: Standard
Special Requirement: Halogen Free/impedance Control
Sillkscreen: White,Black,yellow
Conductor Space: 3 Mil
Aspect Ratio: 10:1
Minimum Hole Size: 0.15mm
Feature: 100% E-test
Layers: Double
Surface Treatment: Immersion Gold
Surface Finish: HASL、ENIG、Immersion Tin、Immersion Silver、Gold Finger、OSP
Materials: FR4
Finished Copper: 35um
Sanforized: Local High Density, Back Drill
Profiling Punching: Routing, V-CUT, Beveling
Surface: OSP
Copper: 1oz
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