Packing: Vacuum Packing With Carton Box
Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP
Impedance Control: Yes
Hole Size: 0.1mm Laser Drill
Layer Count: 4-20 Layers
Hole Size: 0.1mm Laser Drill
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Aspect Ratio: 10:1
Key Words: High Density Interconnector
Special Requirements: Lamp Socket
Pcb Name: 4L 1+N+1 HDI Boards
Thickness: 0.4-3.2mm
Impedance Control: Yes
Hole Size: 0.1mm Laser Drill
Pcb Name: 4L 1+N+1 HDI Boards
Layer Count: 4-20 Layers
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