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Lamp Socket FR4 It180 High Density Interconnect PCB 6L 4-20 Layers

Raw Material: FR4 IT180

Impedance Control: Yes

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Multiclass Impedance Multilayer PCB With Copper Thickness 0.5oz-6oz 4-32 Layers High Density Interconnect HDI

Special Requirements: Multiclass Impedance

Surface Mount Technology: Yes

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Customizable HDI Any Layer PCBs with FR-4 Material Minimum Hole Size 0.1mm Copper Weight 0.5oz-6oz

Layer Count: Any Layer

Testing: Flying Probe Test, E-test

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Good price 20 Layer PCB Board With Multigroup Impedance Control VIPPO Under Paste TU-933 online video

20 Layer PCB Board With Multigroup Impedance Control VIPPO Under Paste TU-933

Layer Count: 4-20 Layers

Minimum Hole Size: 0.15mm

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Good price Multilayer HDI Printed Circuit Board With Half Hole Blind BGA 0.2mm online video

Multilayer HDI Printed Circuit Board With Half Hole Blind BGA 0.2mm

Board Layer: 6-32L

Aspect Ratio: 10:1

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Good price FR-4 High Density Interconnect Any Layer with Minimum Hole Size of 0.1mm,Panasonic MEGTRON 7,M8,M9,Multiple lamination online video

FR-4 High Density Interconnect Any Layer with Minimum Hole Size of 0.1mm,Panasonic MEGTRON 7,M8,M9,Multiple lamination

Material: FR-4

Solder Mask Color: Green, Red, Blue, Black, Yellow, White

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Customizable Anylayer HDI Printed Circuit Board With 3mil Min. Annular Ring

Lead Time: 2-5 Days

Min. Annular Ring: 3mil

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Industrial High Density Interconnect PCB 4-20Layers 0.4-3.2mm Thickness

Minimum Hole Size: 0.15mm

Testing: 100%E-Testing,X-RAY

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Good price 8mil-126mil Thickness High Density PCB HDI Circuit Board  4-20 Layers online video

8mil-126mil Thickness High Density PCB HDI Circuit Board 4-20 Layers

Raw Material: FR4 IT180

Pcb Name: 4L 1+N+1 HDI Boards

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6 Layer Impedance Control HDI Multilayer Pcb 0.2mm-6.00mm Thickness 1+N+1

Impedance Control: Yes

Hole Size: 0.1mm Laser Drill

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OEM 6 Layer High Speed Pcb Board With Lamp Socket 0.4-3.2Mm Impedance Control

Pcb Name: 4L 1+N+1 HDI Boards

Thickness: 0.4-3.2mm

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