any layer hdi pcb (90) Online Manufacturer
Layer Count: 4-20 Layers
Testing: 100%E-Testing,X-RAY
Finished Copper Thickness: 1oz
Silkscreen: White, Black, Yellow, Etc.
Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Special Requirements: Lamp Socket
Aspect Ratio: 10:1
Key Words: High Density Interconnector
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Board Layer: 6-32L
Thickness: 0.4-3.2mm
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Aspect Ratio: 10:1
Testing: 100%E-Testing,X-RAY
Thickness: 0.4-3.2mm
Impedance Control: Yes
Hole Size: 0.1mm Laser Drill
Blind Vias: Yes
Key Words: High Density Interconnector
Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
Min. Annular Ring: 3mil
Solder Mask Color: Green, Red, Blue, Black, Yellow, White
Min Trace: 3/3Mil
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Aspect Ratio: 10:1
Minimum Hole Size: 0.15mm
Raw Material: FR4 IT180
Layer Count: 4-20 Layers
Raw Material: FR4 IT180
Impedance Control: Yes
Send your inquiry directly to us