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OEM HDI Circuit Board 10 Layer 2+N+2 X Ray Tested Ultra Thin 0.2mm-6.00mm

OEM HDI Circuit Board 10 Layer 2+N+2 X Ray Tested Ultra Thin 0.2mm-6.00mm

HDI Circuit Board 0.2mm

HDI Circuit Board 6.00mm

OEM hdi pcb design

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Product Details
Aspect Ratio:
Minimum Hole Size:
Board Thickness:
0.2mm-6.00 Mm(8mil-126mil)
100% E-Testing,X-RAY
Impedance Control:
Layer Count:
4-20 Layers
Key Words:
High Density Interconnector
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Product Description

Impedance Control HDI PCB Board 10 1 Aspect Ratio 10 Layer 2+N+2 X Ray Tested Ultra Thin 0.2mm-6.00mm

Product Description:

The HDI (High Density Interconnector) PCB Board is a technological marvel in the realm of electronic components, meeting the advanced needs of modern electronics with superior performance and reliability. These boards are specifically designed for applications that require a denser configuration of components and a higher number of interconnections. Ideal for high speed PCB board applications, the HDI PCB is a testament to the evolution of circuit board technology, accommodating the trend towards miniaturization without compromising on functionality.

In the heart of the HDI PCB Board lies its impressive capability to support a minimum hole size of a mere 0.15mm. This feature allows for the accommodation of more through-holes per unit area, facilitating the integration of more components on a single board. This miniaturization is a key element in the production of lightweight, compact, and highly efficient devices that are the hallmark of today's electronics market.

Quality and reliability are paramount for HDI PCBs, and to ensure that each board meets the highest standards, a rigorous testing protocol is in place. Every board undergoes 100% E-Testing, where electrical performance is verified to ensure functionality and reliability. Additionally, X-RAY inspection is employed to examine the internal structures of the board, verifying the integrity of the layered constructions and the minute connections that are not visible to the naked eye. This dual testing approach guarantees that each HDI PCB Board is free from defects and ready for the demands of high-speed and high-performance applications.

Catering to a wide range of requirements, the board layer count for the HDI PCB can vary from 6 to a staggering 32 layers (6-32L). This flexibility allows for the design and manufacture of PCBs that can handle a multitude of applications, ranging from the simplest devices to the most complex computing systems. The multilayer design also aids in the reduction of signal loss and cross-talk, which is critical in high speed PCB board applications where signal integrity is essential.

To meet specialized demands, the HDI PCB Board can accommodate special requests such as half holes and a 0.25mm BGA (Ball Grid Array) pitch. Half holes, also known as castellated holes, are used to create an interconnection between boards or to mount components directly to the edge of the PCB. The 0.25mm BGA pitch capability is particularly notable as it allows for a denser packing of ICs (integrated circuits), which is crucial for ultra-compact electronic assemblies. These features underscore the HDI PCB's adaptability to various design and functionality requirements, further establishing its role in the development of cutting-edge electronic products.

The integration of high-density interconnect technology makes the HDI PCB Board an indispensable component in modern electronics, where increasing performance demands coincide with the need for size reduction. The HDI PCB is not just a component; it's a solution that enables the proliferation of advanced electronics in sectors such as telecommunications, computing, medical devices, and aerospace industries. With its exceptional capabilities in supporting high speed PCB board operations and its versatility in accommodating various layer counts and special requests, the HDI PCB stands as a cornerstone of electronic design and manufacturing.

In summary, the HDI PCB Board represents the pinnacle of PCB design, offering a high density interconnector solution for the most demanding electronic applications. With its ultra-fine hole capabilities, stringent testing procedures, adaptable layer counts, and the ability to meet specific design requests, the HDI PCB is the definitive choice for engineers and designers seeking to push the boundaries of what's possible in electronic component miniaturization and functionality.



  • Product Name: HDI PCB Board
  • Hole Size: 0.1mm Laser Drill - ideal for High Speed PCB applications
  • Board Layer: 6-32L - flexible design for complex HDI PCB Manufacturing
  • Min Trace: 3/3Mil - precise and high-resolution line work
  • Special Requirements: Lamp Socket - customized to meet specific needs
  • Testing: 100%E-Testing, X-RAY - ensuring reliability and quality of the HDI PCB Board

Technical Parameters:

Technical Parameter Description
Raw Material FR4 IT180
Special Requirements Lamp Socket
Board Layer 6-32L
Impedance Control Yes
Thickness 0.4-3.2mm
Key Words High Density Interconnector
Layer Count 4-20 Layers
Aspect Ratio 10:1
Hole Size 0.1mm Laser Drill
Special Request Half Hole, 0.25mm BGA


The HDI (High Density Interconnector) PCB is a high-speed PCB board designed to meet the rigorous demands of modern electronics where space, weight, and performance are critical. With a layer count ranging from 4 to 20 layers, these boards are exceptionally versatile and can adapt to various applications, making them ideal for a wide array of occasions and scenarios.

One of the primary applications for HDI PCBs is in the realm of computing, where high-speed PCB performance is paramount. The compact and efficient design of these boards, coupled with the ability to implement 0.25mm BGA (Ball Grid Array) technology, makes them perfect for laptops, servers, and high-performance computers that demand rapid data processing and minimal latency. The half-hole technology is particularly useful in edge-connector applications, ensuring a robust and reliable connection to peripheral devices.

In the telecommunications industry, HDI PCBs are indispensable due to their superior electrical performance and ability to support high-speed signal transmission. The minuscule 3/3Mil min trace allows for a denser routing of signals, which is crucial in smartphones, base stations, and other communication devices that require miniaturization without compromising on speed or signal integrity.

The advent of wearable technology also sees the HDI PCB as a foundational component. The compact size and multi-layer configuration allow for the integration of advanced functionality into sleek, wearable devices. Whether for fitness trackers, smartwatches, or medical monitoring devices, the HDI PCB's attributes like the 0.1mm laser drill hole size are critical for the tiny, precise connections needed in these sophisticated products.

Medical devices, particularly those that require high precision and reliability, benefit immensely from the application of HDI PCB boards. Instruments such as imaging equipment and diagnostic tools rely on the high-speed PCB board's ability to perform consistently under critical conditions. Furthermore, the guarantee of 100% E-Testing and X-RAY testing ensures that each board meets the stringent requirements for medical certifications.

Lastly, in the aerospace and defense sectors, the reliability and high-speed capabilities of HDI PCBs make them suitable for use in avionics, satellite systems, and military communication devices. The rigorous testing and precision manufacturing of these boards mean they can withstand the extreme conditions and provide dependable performance when failure is not an option.

In conclusion, the HDI PCB board is a versatile product that is integral to the advancement of high-speed electronics. Its applications are widespread, touching nearly every facet of the modern technological landscape. From computing to wearable tech, and from healthcare to defense, the HDI PCB stands at the heart of innovation, driving the development of smaller, faster, and more reliable electronic devices.



Our High Speed PCB services cater to the specialized needs of modern electronics by offering the High Density Interconnector (HDI) PCB Board customization. With our capabilities, you can specify a minimum hole size as small as 0.15mm, ensuring that your high density model board can accommodate the intricate design requirements of advanced electronic components.

The HDI PCB Board comes with a range of board thicknesses from 0.2mm up to 6.00mm (8mil-126mil), allowing for a diverse set of applications and durability standards. Whether you are working on a lightweight, portable device or a robust, high-power circuit, we can customize the board to meet your needs.

We also offer a comprehensive layer count customization, with options ranging from 4 to 20 layers. This flexibility ensures that your HDI PCB Board is optimized for its intended use, whether it's for simple devices or complex, multi-functional equipment.

Furthermore, we guarantee Impedance Control with our HDI PCB services. This is critical for maintaining signal integrity in high speed PCB applications, ensuring that your high density model board performs reliably at the speeds demanded by today's technology.


Support and Services:

Our HDI (High-Density Interconnect) PCB Board is backed by comprehensive technical support and services to ensure that you get the most from your product. With expert guidance on design, implementation, and optimization, we are dedicated to providing you with the support you need to keep your HDI PCB Board functioning at peak performance.

Our technical support includes access to a knowledgeable and experienced team of engineers who can assist with any questions or issues that may arise. From initial setup to troubleshooting complex circuitry, our team is here to provide expert advice and solutions.

In addition to support from our team, we offer a range of services designed to extend the life and enhance the functionality of your HDI PCB Board. These services include but are not limited to:

  • Design Review: Ensuring your HDI PCB design meets industry standards and is optimized for manufacturing and performance.
  • Signal Integrity Analysis: Helping you understand and improve the performance of high-speed signals on the board.
  • Thermal Analysis: Providing insights into the thermal characteristics of your board to improve reliability and performance.
  • Advanced Testing Services: Offering a suite of tests to validate the performance and reliability of your HDI PCB, including electrical testing, microsectioning, and environmental testing.

We also provide documentation and resources to help you get the most out of your HDI PCB Board. This includes technical manuals, best practice guides, and application notes that cover a wide range of topics relevant to HDI PCB technology.

Our commitment to your success doesn't end with the sale of our HDI PCB Board. We strive to provide ongoing support and services to ensure your satisfaction and the long-term performance of your product.

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