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1oz Copper High Frequency PCB for Multilayer Configurations

Layer Count: 2-layer

Coverlay Colour: Green

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Rogers Material PCB 0.762mm Glass Epoxy Yellow Coverlay White Silkscreen

Surface: Gold

Glass Epoxy: RO4730G3 0.762mm

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8 Layers Rogers RO4003+FR4 TG170 Gold Surface Rogers Board PCB Green Solder Mask

Function: 100% Pass Electrical Test

Solder Mask: Green, Black, Blue, Yellow, Red Etc.

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Hybrid PCB High Frequency Circuit Board with 0.24W/m-K Thermal Conductivity and Number Of Layers

Copper: 1oz

Glass Epoxy: RO4730G3 0.762mm

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RO4003C Tg170 FR-4 Glass Epoxy Multilayer PCB Board Rogers Circuit Board OEM

Number Of Layers: 4-22 Layers

Copper Weight: 12OZ

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Rogers Multilayer PCB Board Quick Turn From 24 Hour Customized 0.2mm-6.0mm

Thickness: 0.2mm-6.0mm

Copper Thickness: 0.5oz-6oz

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Gold Finished 12 Layer PCB Board Black High Density Interconnect PCB With BGA

Packing: Vacuum Packing With Carton Box

Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP

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1.6mm Rogers Circuit Board 8 Layers R4003+FR4 TG170 IPC3 Mixture Impedance And VIPPO

Function: 100% Pass Electrical Test

Material: Rogers R5880

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1.6mm Thickness Rogers R4350B PCB Board Dielectric Constant 2.55-10.2

Function: 100% Pass Electrical Test

Coverlay Colour: Yellow

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2-layer High Frequency Printed Circuit Board Layer Count 100% Electrical Test Prior Shipment

Copper: 1oz

Test: 100% Electrical Test Prior Shipment

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Hight Frequency Rogers Board PCB 1.6mm Dielectric 4 Layers R4003+IT180 Mixture

Silkscreen Color: White, Black, Yellow

Surface: Gold

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High Speed TU-933 FR-4 Glass Epoxy DK 3.6 Multilayer PCB Board 4-22 Layers

Thickness: 0.2mm-6.0mm

Copper Weight: 12OZ

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High Speed SMT THT DIP SMT PCB Assembly Process with High Density Interconnector Glass Epoxy Rogers Corp. PCB Board

Surface Mount Technology: Available

Vip Process: Yes

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SMT THT DIP Assembly HDI PCB Board with Mini Holes 0.1mm and High Density Interconnector

Key Words: High Density Interconnector

Feature: Immersion Silver

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±10% Thickness White Silkscreen HDI PCB Board for Density Interconnect Applications

Mini Holes: 0.1mm

Min. Solder Mask Bridge: 0.075mm

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SMT THT DIP Assembly Process HDI PCB Board with HASL Surface Finish and 0.5oz-6oz Copper Thickness

Thickness: 1.6mm, ±10%

Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.

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HDI PCB Board

Multilayer PCB Board

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Goldfinger Rogers PCB Board 16 Layers 100% Electrical Test Pass VIPPO Rogers+FR4 Mixed

0.78mm Thickness Rogers PCB Board in Yellow Silkscreen Color and with Gold Surface

E-car Rogers PCB Board with 1.6mm Thickness and 2-layer Design

E-car Rogers PCB Board with 1.6mm Pcbthickness and 0.78mm Board Thickness

1oz Copper High Frequency PCB for Multilayer Configurations

Rogers Material PCB 0.762mm Glass Epoxy Yellow Coverlay White Silkscreen

8 Layers Rogers RO4003+FR4 TG170 Gold Surface Rogers Board PCB Green Solder Mask

Hybrid PCB High Frequency Circuit Board with 0.24W/m-K Thermal Conductivity and Number Of Layers

RO4003C Tg170 FR-4 Glass Epoxy Multilayer PCB Board Rogers Circuit Board OEM

Rogers Multilayer PCB Board Quick Turn From 24 Hour Customized 0.2mm-6.0mm

Gold Finished 12 Layer PCB Board Black High Density Interconnect PCB With BGA

1.6mm Rogers Circuit Board 8 Layers R4003+FR4 TG170 IPC3 Mixture Impedance And VIPPO

1.6mm Thickness Rogers R4350B PCB Board Dielectric Constant 2.55-10.2

2-layer High Frequency Printed Circuit Board Layer Count 100% Electrical Test Prior Shipment

Hight Frequency Rogers Board PCB 1.6mm Dielectric 4 Layers R4003+IT180 Mixture

High Speed TU-933 FR-4 Glass Epoxy DK 3.6 Multilayer PCB Board 4-22 Layers

High Speed SMT THT DIP SMT PCB Assembly Process with High Density Interconnector Glass Epoxy Rogers Corp. PCB Board

SMT THT DIP Assembly HDI PCB Board with Mini Holes 0.1mm and High Density Interconnector

±10% Thickness White Silkscreen HDI PCB Board for Density Interconnect Applications

SMT THT DIP Assembly Process HDI PCB Board with HASL Surface Finish and 0.5oz-6oz Copper Thickness