hdi multilayer pcb (60) Online Manufacturer
Packing: Vacuum Packing With Carton Box
Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP
Layers: 12 Layers
Material: TACNIC TSM-DS3
Layers: 12 Layers
Material: Shengyi S1000 TG170
Layers: 1 Layer
Material: SAR20H From Shengyi
Inner Layer Spacing: 0.15mm
Thickness: 0.4-3.2mm
Blind And Buried Vias: Available
Thickness: 0.4-3.2mm
Board Layer: 6-32L
Aspect Ratio: 10:1
Raw Material: FR4 IT180
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Smallest Hole Size: 0.1mm
Min Via: 0.1mm
Layers: 8 Layer
Material: ShengYi S1000
Layers: 7 Layers
Material: Shengyi S1000 TG170
Layers: 2
Material: TG170
Layers: 8 Layer
Material: ShengYi S1000
Layers: 1 Layer
Material: Aluminum 1W
Layers: 2 Layers
Material: AL2O3
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