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Advanced Insulation Sheet IMS PCB with Rated Voltage ≥40KV and Length 1200 MM

Type: Insulation Sheet

Special Technology: PCBA For Horti Light

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Customizable Anylayer HDI Printed Circuit Board With 3mil Min. Annular Ring

Lead Time: 2-5 Days

Min. Annular Ring: 3mil

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IMS PCB Special Technology PCBA For Horti Light PCB Base Board Impedance Control Yes

Solder Mask Color: Green/Red/Blue/Black

Board Thickness: 6.5mm

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1.6MM Board Thickness Airport Led Lighting PCBA AL3003 Material

Layers: 1 Layser

Material: AL3003

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1-28 Layers Rigid Flex PCB BGA Components for PCB Assembly

Bend Radius: 0.5-10mm

Components: SMD, BGA, DIP, Etc.

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6.5mm Board Thickness Polytronics PCBs The Ultimate Performance

Board Thickness: 6.5mm

Copper Thickness: 0.5-3oz

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Final Foil External 1.oz Multilayer Printed Board 2-30 Layer Count for Products

Pcb: Single,double,multilayer Pcb,custom Pcb

Final Foil External: 1.oz

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Max. Panel Size 600mm*1200mm Multilayer Printed Circuit Board for Customer Requirements

Min. Hole Size: 0.2mm

Copper Thickness: 0.5oz-6oz

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Surface Mount Technology Yes Multilayer Circuit Board with ENIPIG Surface

Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP

Thickness: 0.2mm-6.0mm

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100% Electrical Test Prior Shipment High Density Model Board with 10 1 Aspect Ratio

Impedance Control: +/-10%

Misalignment Of Layers: +/- 0.06

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Multilayer Printed Circuit Board Copper 1oz Multiclass Impedance Ready for Manufacturing

Copper Weight: 0.25OZ~12OZ

Minimum Hole Diameter: 0.10 Mm

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Hole Position Deviation ±0.05mm Flexible Rigid Printed Circuit Board for SMD Components

Profiling Punching: Routing, V-CUT, Beveling

Bend Radius: 0.5-10mm

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1.6mm Rogers Circuit Board 8 Layers R4003+FR4 TG170 IPC3 Mixture Impedance And VIPPO

Function: 100% Pass Electrical Test

Material: Rogers R5880

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Conductor Space 3 Mil Dual-Sided Printed Wiring Board for Tight Tolerance Requirements

Sillkscreen: White,Black,yellow

Conductor Space: 3 Mil

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Polyimide FR4 Density 28-Layer Rigid Flex Circuit Board With SMD Components

Sanforized: Local High Density, Back Drill

Profiling Punching: Routing, V-CUT, Beveling

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