2025-06-24
· Specialized in high-speed and high-frequency PCB fabrication, leveraging advanced processes for signal integrity and reliability.
· Expertise in material selection, impedance control, and precision manufacturing for aerospace, telecom, and medical devices.
· Rigorous quality assurance and global-standard compliance ensure optimal performance in high-frequency environments.
High-speed and high-frequency PCBs demand meticulous design and manufacturing to minimize signal loss, crosstalk, and electromagnetic interference (EMI). Unlike standard PCBs, these boards handle data rates exceeding 10 Gbps and frequencies above 1 GHz, requiring:
· Advanced Laminate Materials: Rogers RO4350B, Isola FR408HR, or Arlon AD255 for low dielectric loss (Df) and stable impedance.
· Precision Impedance Control: Tight tolerance (±5%) for microstrip and stripline designs to maintain signal integrity.
· Thermal Management: Copper cladding and thermal vias to dissipate heat in high-power applications.
Tip: Choose high-frequency PCBs for 5G base stations, radar systems, and high-performance computing where signal stability is critical.
· Laminate Evaluation: Rigorous testing of dielectric constant (Dk) and thermal expansion coefficient (CTE) to match design requirements.
· Copper Foil Treatment: Electrodeposited (ED) or rolled annealed (RA) foil for reduced surface roughness, minimizing signal degradation.
· Laser Drilling: Ultraviolet (UV) lasers for microvias as small as 50μm, enabling high-density interconnects (HDI).
· Electroless Plating: Uniform copper deposition for consistent impedance and solderability.
· Reflow Soldering: nitrogen-protected ovens to prevent oxidation and ensure reliable solder joints.
Test Method |
Purpose |
Standard |
Time Domain Reflectometry (TDR) |
Impedance verification |
IPC-6012 Class 3 |
Scanning Electron Microscopy (SEM) |
Surface finish analysis |
IPC-TM-650 |
Thermal Cycling |
Durability under temperature stress |
MIL-STD-883 |
1.Specialized Equipment & Expertise
o State-of-the-art CNC machines for multilayer PCB lamination (up to 40 layers).
o In-house design support for high-frequency circuit layouts, including ANSYS HFSS simulation.
2. Material Competency
o Certified distributor for Rogers and Isola laminates, ensuring traceability and performance.
o Custom material solutions for extreme environments (e.g., -55°C to +125°C temperature ranges).
3. Quality Assurance
o ISO 9001:2015, IPC-A-610 Class 3, and AS9100D certification for aerospace-grade reliability.
o 100% automated optical inspection (AOI) and X-ray fluoroscopy for hidden defect detection.
4. Rapid Prototyping & Scalability
o 24-48 hour turnaround for prototype orders, supported by digital manufacturing workflows.
o Volume production capabilities with consistent lot-to-lot uniformity.
· 5G Telecommunications: 16-layer Rogers RO4350B PCBs for mmWave antenna arrays, achieving <0.5 dB insertion loss at 28 GHz.
· Aerospace Radar Systems: High-temperature resistant PCBs with silver-plated vias, passing MIL-STD-202 vibration tests.
· Medical Imaging: Ultra-thin (0.1mm) high-frequency PCBs for MRI scanner signal processing, minimizing EMI interference.
Q: What makes your high-frequency PCBs different?
A: Our focus on material science, coupled with advanced testing, ensures <1% failure rates in high-frequency applications.
Q: Can you support lead-free manufacturing?
A: Yes, all processes comply with RoHS and REACH standards, using tin-silver-copper (SAC) alloys.
Q: How do you handle impedance control for complex designs?
A: We use 3D field solvers during design and TDR testing post-fabrication to maintain ±5% impedance tolerance.
For high-speed, high-frequency PCB solutions that blend technical excellence with manufacturing precision, visit our website or contact our engineering team for custom solutions. Trust us to deliver boards that excel in the most demanding electronic environments.
P.S.:Customer-authorized imagery
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