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Home > news > Company news about Heavy Copper PCB - The "Muscle Man" of Power Electronics
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Heavy Copper PCB - The "Muscle Man" of Power Electronics

2025-07-07

Latest company news about Heavy Copper PCB - The

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CONTENTS​

  • Key Takeaways​
  • The Current Landscape of Thick Copper PCBs​
  • The Revolutionary Promise of Superconducting Thick Copper​
  • Active - Cooling Thick Copper: A New Era of Thermal Management​
  • Comparative Analysis of Future - Oriented Thick Copper Technologies​
  • Potential Real - World Applications and Impact​
  • Challenges and Hurdles Ahead​
  • Vision for the Future​
  • FAQ​


Key Takeaways​


   1.Superconducting thick copper, leveraging high - temperature superconducting materials, could enable zero - resistance current flow at cryogenic temperatures, revolutionizing high - power applications.​
   2.Active - cooling thick copper with embedded microfluidic channels offers dynamic heat dissipation, mimicking biological cooling systems for AI chips.​
   3.These futuristic thick copper PCB technologies have the potential to reshape industries from energy to computing, but face significant technical and practical challenges.​


The Current Landscape of Thick Copper PCBs​

   Thick copper PCBs have long been valued for their ability to handle high currents and dissipate heat effectively in applications such as power supplies, industrial electronics, and automotive systems. Traditional thick copper PCBs typically feature copper layers ranging from 70 to 210 micrometers in thickness, providing enhanced conductivity compared to standard PCBs. However, as technological demands escalate towards higher power densities and faster data transfer rates, the future of thick copper PCBs is set to undergo a dramatic transformation.​


The Revolutionary Promise of Superconducting Thick Copper​

Technical Highlights​
    Superconducting thick copper represents a paradigm shift in electrical conduction. By employing high - temperature superconducting materials, such as yttrium - barium - copper - oxide (YBCO) thin films, these PCBs can achieve zero electrical resistance. This remarkable property occurs at relatively “high” cryogenic temperatures, specifically around the boiling point of liquid nitrogen (-196°C). At these temperatures, superconducting thick copper can carry currents in the range of millions of amperes without any power loss due to resistance.​


Applications​
    One of the most promising applications of superconducting thick copper PCBs lies in nuclear fusion research, particularly in devices like the International Thermonuclear Experimental Reactor (ITER) Tokamak. In fusion reactors, precise and powerful magnetic fields are required to confine and control the superheated plasma. Superconducting thick copper PCBs could serve as the backbone for the magnetic field control systems, enabling the generation of extremely strong and stable magnetic fields with minimal energy consumption.​


Sci - Fi Connection​
    The widespread adoption of superconducting thick copper could have far - reaching implications. Imagine a future where city power grids are essentially giant, lossless “super PCBs,” transmitting electricity across vast distances without any energy dissipation. This could redefine the global energy infrastructure, making power transmission more efficient and sustainable.​


Active - Cooling Thick Copper: A New Era of Thermal Management​

Technical Highlights​
    Active - cooling thick copper PCBs introduce a novel approach to thermal management. These boards incorporate microfluidic channels directly into the thick copper layers. A coolant, often a liquid metal with excellent thermal conductivity, is pumped through these channels in a closed - loop system. This setup acts like a “blood circulation” system for the PCB, actively removing heat generated by high - power components. Similar to how human sweat glands regulate body temperature, the active - cooling system dynamically responds to changing heat loads, ensuring optimal operating temperatures.​


Applications​
   In the rapidly evolving field of artificial intelligence (AI), where GPUs and other high - performance chips generate massive amounts of heat, active - cooling thick copper PCBs offer a game - changing solution. By providing “vascularized cooling,” these PCBs can support the ever - increasing computational demands of AI algorithms, preventing thermal throttling and extending the lifespan of critical components.​


Visual Metaphor​
   Think of an active - cooling thick copper PCB as having an “electronic heart.” This heart pumps coolant throughout the board, replacing traditional bulky fans and heat sinks with a more compact, efficient, and intelligent cooling mechanism.​


Comparative Analysis of Future - Oriented Thick Copper Technologies

Technology
Superconducting Thick Copper
Active - Cooling Thick Copper
Operating Temperature
-196°C (liquid nitrogen)
Ambient to elevated temperatures
Electrical Resistance
Zero at superconducting state
Standard copper resistance
Heat Dissipation Mechanism
N/A (no resistive heating)
Active pumping of coolant through microfluidic channels
Current - Carrying Capacity
Millions of amperes
High, but limited by copper's normal properties
Key Applications
Nuclear fusion, high - field magnets
AI computing, high - power electronics
Technical Challenges
Requires cryogenic cooling, material integration
Fluidic system complexity, leakage prevention


Potential Real - World Applications and Impact​
   Beyond the specific examples mentioned, the future of thick copper PCBs could transform numerous industries. In the aerospace sector, superconducting thick copper could enable more efficient electric aircraft, while active - cooling thick copper would support advanced avionics systems. In data centers, these technologies could reduce energy consumption and increase computing density, driving the next wave of digital innovation.​


Challenges and Hurdles Ahead​

   Superconducting Thick Copper: The need for cryogenic cooling systems adds complexity and cost to applications. Additionally, integrating superconducting materials with existing PCB manufacturing processes poses significant technical challenges.​
   Active - Cooling Thick Copper: Ensuring the long - term reliability of the microfluidic channels, preventing coolant leakage, and maintaining a balance between cooling efficiency and power consumption for the pumping system are critical issues that need to be addressed.​


Vision for the Future​

   Despite the challenges, the potential of superconducting and active - cooling thick copper PCBs is too great to ignore. As research and development efforts continue, we may witness a future where these technologies become mainstream, enabling “higher, faster, stronger” electronics that were once the stuff of science fiction.​


FAQ​
Can superconducting thick copper be used at room temperature?​
Currently, high - temperature superconducting materials still require cryogenic temperatures close to -196°C. Research is ongoing to discover materials that can superconduct at higher temperatures, but significant breakthroughs are still needed.​


How reliable are the microfluidic channels in active - cooling thick copper PCBs?​
While the concept shows great promise, ensuring the long - term reliability of microfluidic channels is a key area of research. Manufacturers are working on improving sealing techniques and material compatibility to prevent leakage and blockages.​


What industries will benefit the most from these future thick copper PCB technologies?​
Industries such as energy (fusion power), computing (AI and data centers), aerospace, and advanced manufacturing are likely to experience the most significant benefits from the adoption of superconducting and active - cooling thick copper PCBs.

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