High-Frequency Mixed-Pressure PCB: The Perfect Balance of Performance and Cost

With the rapid development of electronic technology, the demand for high-frequency and high-speed PCBs is constantly increasing. To meet this demand and reduce production costs, mixed-pressure PCB technology has emerged. This article introduces a 6-layer high-frequency PCB using a Rogers 4003 + IT180A mixed-pressure structure. It retains high-frequency performance while saving material costs through the mixed-pressure structure.

This PCB uses a copper paste via-in-pad process, effectively reducing signal transmission resistance and loss, ensuring signal transmission integrity and accuracy. In addition, the design of metal edging and controlled-depth milling grooves enhances the mechanical strength of the product, effectively shields electromagnetic interference, and improves signal transmission quality. Mixed-pressure technology provides new ideas for the design of high-frequency PCBs, providing a powerful guarantee for the balance of performance and cost of electronic devices.

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