In today's rapidly evolving world of electronics, HDI circuit boards (High-Density Interconnect) have become the core components of numerous high-end electronic products due to their high integration and performance. Today, we unveil a 34-layer HDI circuit board, showcasing the cutting-edge technology and application potential in the field of multilayer boards.
This product boasts a thickness of 6.35mm, a minimum hole diameter of 0.25mm, and an impressive aspect ratio of 25:1, making it a pinnacle achievement in the industry. Such a high aspect ratio presents unprecedented challenges during production.
Firstly, drilling processes face significant hurdles. The drill bit needs to penetrate a thicker material, encountering greater friction and cutting forces, leading to potential wear and even breakage. Secondly, maintaining drill hole perpendicularity becomes a major challenge, as slight deviations are magnified on thicker boards, affecting subsequent plating and signal transmission. Lastly, the high aspect ratio demands exceptionally precise plating processes, as the exchange and flow of plating solution within the holes become difficult, potentially causing uneven plating thickness and impacting the conductivity of the holes.
Sliced images
To overcome these challenges, the production team employed advanced precision drilling techniques, rigorously controlled drilling accuracy, and optimized plating processes to ensure uniform plating thickness. Additionally, high-quality base materials and copper foil were selected to guarantee the stability and reliability of the circuit board.
The successful creation of this 34-layer HDI circuit board demonstrates the production team's meticulous craftsmanship, providing a powerful performance guarantee for high-end electronic products.
We are LT CIRCUIT and we only provide standard quality PCBs.
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